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10 Micron Pure Electrolytic Thin Copper Foil Product Details 1. pure electrolytic copper foil 2. Thickness:0.006-0.04mm 3. Width:10-1285mm 4. Process: electrolysis 5. Surface: single-polished;double-polished;nickel coated;galvanized; Thickness weight in standard 0.006mm 53-56 G/M3 0.007mm 62-67 G/M3 0.008mm 71-76 G/M3 0.009mm 85-90 G/M3 0.012mm 104-110 G/M3 0.015mm 126-132 G/M3 0.018mm 148-158 G/M3 0.022mm 180-190 G/M3 Product Introduction Electrolytic copper foil is an

High Purity Soft 10um Conductive Copper Foil Rolls Description Of The Products : Brief Information : Copper Foil is rolled from pure copper ingots, the process including purifying copper ores, make into copper cathodes, ingoting, rolling, annealing, washing, testing, slitting and packing. Our copper ores are imported from South America, which were famous for their copper mining. 110-anneal (Electrolytic Tough Pitch or ETP) dead soft. Min 99.96% CU This is high quality copper

C1100 C1020 Thin Insulated Copper Foil Rolls Quick Detail: Model No. LLF-750 LLF-1100 LLF-1300 LLF-1600 Foil Grade O, H14 O, H14 O, H14 O, H14 Foil Thickness 0.006-0.02mm 0.006-0.02mm 0.006-0.02mm 0.006-0.02mm Foil Width 650mm 1000mm 1250mm 1500mm Foil O.D Φ650mm Φ 650mm Φ 650mm Φ 650mm Slitting Width ≥10mm ≥10mm ≥10mm ≥10mm Slitting Speed 0-250m/min 0-250m/min 0-250m/min 0-250m/min Total Power 13kw/380V 18.5kw/380V 18.5kw/380V 26kw/380V Core I.D 3", 6" 3", 6" 3", 6"

Corrosion Resistant Conductive Clad Tin Plated Copper Foil Description : Tin cladded copper foil mainly solved surface unsmoothly and thickness uneven when ordinary copper foil is tinned. It has high peel strength on the laminated surface due to some special treatment. Also the whole process were done in room temperature and would not change metal structure. Structure: Material Thickness (%) Sn | Cu | Sn 3~4% | 92~94% | 3~4% Advantage : • Corrosion resistant tin clad foil •

Single Side Rolled Thickness 0.035mm Nickel Plated Copper Foil 1. Description Nickel has strong passivation ability because its high stability in the air. It can form a very thin passivation film in the air which can resist atmospheric alkali and some acid corrosion. It makes nickel plated product with good chemical stability during working or under alkaline environment. Nickel plated product is not easy to change color and can be oxidized when the temperature is above 600℃

Width 1295mm ED Pure Electrodeposited Copper Foil Specification: As the irreplaceable, critical and basis materials of the electronic industry, the ED copper foils are mainly used in the production of the CCL,PCB and the Li-ion Secondary Battery. With the development of the multi-function,small size, and light weight of the electornic information complete products, the high-quality,special performance, and superior ED copper foils will be the leading products to satisfy the

9um 12um 18um 35um High Density FPC PCB Copper Foil Specification: Thickness: 9µm～35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film. Features: High density, high bending resistance and good etching performance. Microstructure: Table1- Performance: Classification Unit 9μm 12μm 18μm 35μm Cu Content % ≥99.8 Area Weigth g/m2 80±3 107±3 153±5 283±7

8um 10um 12um Lithium Battery Pure Electrolytic Copper Foil Item T-Cu-08 T-Cu-10 T-Cu-12 width (mm) customized Thickness (um) 8 10 12 areal density (g/m2) 85-90 95-100 105-110 Purity(%) More than 99.9% Cu ≥99.9% Fe < 0.0010% Bi < 0.00020% Pb < 0.0005% Roller core inner diameter 76mm Width 200mm Tensile strength (MPa) ≥294 ≥300 ≥305 Normal elongation(%) 2.5 2.7 3.0 High temperature Tensile strength180℃(MPa) ≥147 ≥150 ≥153 High temperature elongation180℃(%) 2 2 2.5 Anti

CCL / PCB Insulation Thickness 15um Pure Copper Foil Description CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD), High temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF). Feature Improve the consistency of battery usage group and reduce battery cost significantly. Improve the adhesion of active material and the collector, and reduce the electrode