PCB 구리 포일

Electrolytic PCB Copper Foil Specification: 1. CCL/PCB copper foil are classfied as: STD,HTE,VLP,FCF,and RTF. 2. Now,we talk about HTE copper foil. 3. For S-HTE copper foil, we can do ordinary thickness ,such as, 12μm, 18μm, 25μm, 35μm, etc. 4. The Maximum width is 1295mm. 5. The usage of S-HTE copper foil : widely usesd in shielding signals , and also in the electronic wires and cables. Technical Data: Classification Unit 1/4OZ (9μm) 1/3OZ (12μm) J OZ (15μm) 1/2OZ (18μm) 1OZ

C11000 PCB Copper Foil GB/TDINENASTMTU2E Cu58Cu ETPC11000 Material introduction:C11000(Cu ETP) Cu ETP is an electrolytically refined oxygen-containing copper. It has good electrical conductivity but compared with other high conductivity copper due to the high residua oxygen content of the alloy it is not suitable for processing (annealing welding etc.) and use in high temperature ( temperature greater than 370 ° C ) reducing gas. Because it is prone to hydrogen embrittlement

105um Single Shiny Heavy ED PCB Copper Foil Specifications: We provide the 1/3oz/ft²to 2oz/ft²(nominal thickness 105μm~500μm)very-low-profile, high temperature elongation, and heavy (VLP-THE-HF)ED copper foils, they are sheet products; and the max width is 1295mm. They have the perfect physical characteristics of the fine and uniform crystal structure, the low profile, the high intensity, and high elongation, and they also have the PCB manufacturing performances of the high

CCL Thickness 9 Micron Red PCB Copper Foil Description: CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD),High-temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF).Ordinary thickness of the ED copper foils are 9 microns and 12 microns ,18 microns,35 microns etc. The maximum width of the ED copper foil iw 1370mm(53.93inch),.Also we can do special

Width 1295mm ED Pure Electrodeposited Copper Foil Specification: As the irreplaceable, critical and basis materials of the electronic industry, the ED copper foils are mainly used in the production of the CCL,PCB and the Li-ion Secondary Battery. With the development of the multi-function,small size, and light weight of the electornic information complete products, the high-quality,special performance, and superior ED copper foils will be the leading products to satisfy the

9um 12um 18um 35um High Density FPC PCB Copper Foil Specification: Thickness: 9µm～35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film. Features: High density, high bending resistance and good etching performance. Microstructure: Table1- Performance: Classification Unit 9μm 12μm 18μm 35μm Cu Content % ≥99.8 Area Weigth g/m2 80±3 107±3 153±5 283±7

C11000 Insulation Transformer PCB Copper Foil Features of Copper Foil 1) Thickness: from 0.006mm to 0.1.mm 2) Maximum Width:650mm 3) Min trial order: 100kg for normal thickness Applications for Copper Foil 1) Transformer 2) Water Heater exchanger unit 3) Automotive manufacturers Production capacity for Copper Foil 550 tons output per month 100kg trial order is available Name GB ALLOY NO. SIZE (mm) (ISO) (ASMT) (JIS) (BIS) (DIN) Copper Foil T2 Cu-ETP C11000 C1100 C101 R-Cu57

Electrolytic Flexible RA Copper Sheet Roll Dimension Range: Thickness Range: 12μm~100μm, Width(Max.): 600mm Performances: High flexibility and extensibility Even and smooth surface Good fatigue resistance Strong antioxidant properties Good mechanical properties Applications: Flexible Copper Clad Laminate(FCCL), Fine Circuit FPC, LED coated crystal thin film. Features: The material has higher extensibility, and has a high bending resistance and no crack. Table 1:FPC T2 high